JPH0344404B2 - - Google Patents
Info
- Publication number
- JPH0344404B2 JPH0344404B2 JP61099009A JP9900986A JPH0344404B2 JP H0344404 B2 JPH0344404 B2 JP H0344404B2 JP 61099009 A JP61099009 A JP 61099009A JP 9900986 A JP9900986 A JP 9900986A JP H0344404 B2 JPH0344404 B2 JP H0344404B2
- Authority
- JP
- Japan
- Prior art keywords
- holding plate
- chip
- flat plate
- chip component
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 12
- 239000013013 elastic material Substances 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packages (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61099009A JPS61268003A (ja) | 1986-04-28 | 1986-04-28 | チツプ部品の保持プレ−ト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61099009A JPS61268003A (ja) | 1986-04-28 | 1986-04-28 | チツプ部品の保持プレ−ト |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1112462A Division JPH0214510A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレート |
| JP1112459A Division JPH0214507A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレート |
| JP1112460A Division JPH0214508A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレートの製造方法 |
| JP1112461A Division JPH0214509A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61268003A JPS61268003A (ja) | 1986-11-27 |
| JPH0344404B2 true JPH0344404B2 (en]) | 1991-07-05 |
Family
ID=14235080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61099009A Granted JPS61268003A (ja) | 1986-04-28 | 1986-04-28 | チツプ部品の保持プレ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61268003A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63138985A (ja) * | 1986-12-01 | 1988-06-10 | 松下電器産業株式会社 | 電子部品保持体 |
| JPH0810181Y2 (ja) * | 1990-01-31 | 1996-03-27 | 太陽誘電株式会社 | 端部コーティング用電子パーツ保持具 |
-
1986
- 1986-04-28 JP JP61099009A patent/JPS61268003A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61268003A (ja) | 1986-11-27 |
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